• DocumentCode
    1736266
  • Title

    Parametric Testing of Optical Interfaces

  • Author

    Achkir, Brice ; Zivny, Pavel ; Eklow, Bill

  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    This series will discuss board and system level testing of high speed optical interfaces. Today these interfaces operate up to 10 Gbps over short, medium and long ranges. In the not too distant future, these interfaces will be operating in ranges up to 40 Gbps. There are several factors that can affect the performance of board/system level high speed, serial interfaces, including signal integrity issues in the optics and at the board level, power and other components such as clocks. The application series will provide background on high speed serial interfaces and techniques used to test these interfaces. This background will include a discussion about optical and electrical parameters that are tested and how they could impact the performance of these interfaces. The application series will continue with a discussion of the different test techniques. One aspect of this will include a discussion of the lack of standardization in the measurements that are taken by test equipment. The application series will conclude by talking about future interfaces and what it will take to effectively tests those interfaces.
  • Keywords
    integrated optoelectronics; optical communication equipment; optical interconnections; optical logic; testing; board level testing; electrical parameter; high speed optical interface; including signal integrity; optical interface parametric testing; optical parameter; system level testing; Clocks; High speed optical techniques; Nonlinear optics; Optical devices; Standardization; System testing; Test equipment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2008. ITC 2008. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-2402-3
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2008.4700655
  • Filename
    4700655