DocumentCode
1736498
Title
Folded meandered-patch monopole antenna for triple-band operation
Author
Fa-Shian Chang ; Wen-Kuan Su ; Kin-Lu Wong
Author_Institution
Dept. of Phys., Chinese Mil. Acad., Feng-Shan, Taiwan
Volume
1
fYear
2003
Firstpage
278
Abstract
The meandered patch is generally formed by cutting several linear slits in a planar conducting patch to meander the excited patch surface current path. The meandered patches are generally in planar structures. We demonstrate a novel antenna design utilizing a meandered patch folded into a compact three-dimensional structure. The proposed antenna is suitable for applications in mobile phones for GSM (global system for mobile communication, 890-960 MHz), DCS (digital communication system, 1710-1880 MHz) and PCS (personal communication system, 1850-1990 MHz) triple-band operations. In addition, owing to the proposed folding design, the antenna height is greatly reduced (to 8 mm) and can be mounted on top of a grounded substrate with a distance of 7 mm, leading to a low profile of only 16 mm (about 4.2% of the wavelength at 900 MHz) from the ground plane. This characteristic makes it very promising for the proposed antenna to be placed within the mobile phone housing, leading to a concealed mobile phone antenna.
Keywords
UHF antennas; antenna radiation patterns; cellular radio; microstrip antennas; mobile antennas; mobile handsets; monopole antennas; multifrequency antennas; 16 mm; 1710 to 1880 MHz; 1850 to 1990 MHz; 7 mm; 8 mm; 890 to 960 MHz; DCS; GSM; PCS; antenna height; digital communication system; folded meandered-patch antenna; folded patch antenna; global system for mobile communication; mobile phone antennas; monopole antenna; personal communication system; radiation patterns; three-dimensional structure; triple-band operation; Antenna measurements; Copper; Feeds; GSM; Joining processes; Microstrip antennas; Mobile antennas; Mobile handsets; Personal digital assistants; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2003. IEEE
Conference_Location
Columbus, OH, USA
Print_ISBN
0-7803-7846-6
Type
conf
DOI
10.1109/APS.2003.1217452
Filename
1217452
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