DocumentCode :
1736730
Title :
I/sub DDQ/ testing for submicron CMOS IC technology qualification
Author :
Soden, Jerry M.
Author_Institution :
Failure Anal. Dept., Sandia Nat. Labs., Albuquerque, NM, USA
fYear :
1997
Firstpage :
52
Lastpage :
56
Abstract :
Sandia is manufacturing high reliability CMOS ICs with a 0.5 micron CMP technology, as part of the progression to 0.35 micron and smaller scale technologies. To qualify this technology for delivery of high reliability ICs to customers for military, space, and commercial applications, a qualification program has been implemented that includes extensive loop testing. Two vehicles are being used for this qualification, a 256 K bit SRAM and a Microcontroller Core (MCC). Both of these ICs present unique loop testing challenges. This paper describes the methods used to successfully implement I/sub DDQ/ testing for these two types of ICs.
Keywords :
CMOS digital integrated circuits; 0.5 micron; 256 Kbit; CMOS IC technology qualification; CMP technology; I/sub DDQ/ testing; SRAM chip; Sandia; high reliability CMOS ICs; loop testing; microcontroller core; qualification program; submicron CMOS ICs; CMOS integrated circuits; CMOS technology; Failure analysis; Integrated circuit testing; Isolation technology; Manufacturing; Qualifications; Random access memory; Space technology; Sputter etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IDDQ Testing, 1997. Digest of Papers., IEEE International Workshop on
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-8186-8123-3
Type :
conf
DOI :
10.1109/IDDQ.1997.633013
Filename :
633013
Link To Document :
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