Highly inclined electrodeposited metal lines using an excimer laser patterning technique

This paper presents a simplified fabrication method to make highly elevated electrical signal lines up to 700 μm in height from the substrates. The immediate application is a bioMEMS device that requires high aspect ratio three-dimensional (3D) multi-electrode arrays (MEA) to detect signals from deep within 3D networks of neurons. The demonstrated method generated thick electroplated metal lines on excimer laser patterned parylene molds. The directionality of the laser beam makes it possible to achieve practically straight patterns on the inclined sidewalls in addition to the bottom surface, which are several hundred microns below. 3D multi-electrodes on various elevation surfaces and insulation of parylene coating were efficiently implemented by using the directionality of excimer lasers and the conformal coating of parylene.