DocumentCode :
1736776
Title :
Fabrication challenges for a complicated micro-flow channel system at low temperature process
Author :
Liu, C.W. ; Gau, C. ; Ko, H.S. ; Dai, B.T.
Author_Institution :
National Nano Device Labs., Hsin-Chu, Taiwan
Volume :
2
fYear :
2005
Firstpage :
1477
Abstract :
This paper will present fabrication challenges for a complicated micro channel system at low temperature process by MEMS techniques. This channel will be integrated with an array of temperature sensors and a set of heaters for the purpose of study on the micro-scale heat transfer inside. The heat transfer results may provide a clue whether the microchannel cooling process can be used to solve the future cooling problem encountered in an extremely high power density CPU chip. Design and fabrication challenges encountered in this processes are discussed. A final measurement for the validation of the heaters and the sensors fabricated and a study of the heat transfer coefficient distributions inside the micro channel are also presented.
Keywords :
cryogenic electronics; microfluidics; microprocessor chips; microsensors; temperature sensors; MEMS; heater; high power density CPU chip; integrated system; low temperature process; microchannel cooling; microflow channel system fabrication; microscale heat transfer; temperature sensor array; Boundary conditions; Cooling; Fabrication; Glass; Heat transfer; Sensor arrays; Silicon; Temperature sensors; Thermal conductivity; Thermal sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN :
0-7803-8994-8
Type :
conf
DOI :
10.1109/SENSOR.2005.1497362
Filename :
1497362
Link To Document :
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