• DocumentCode
    173687
  • Title

    Extending support to customised multi-point haptic devices in CHAI3D

  • Author

    Lei Wei ; Najdovski, Zoran ; Hailing Zhou ; Deshpande, S. ; Nahavandi, S.

  • Author_Institution
    Centre for Intell. Syst. Res., Deakin Univ., Geelong, VIC, Australia
  • fYear
    2014
  • fDate
    5-8 Oct. 2014
  • Firstpage
    1864
  • Lastpage
    1867
  • Abstract
    CHAI3D is a widely accepted haptic SDK in the society because it is open-source and provides support to devices from different vendors. In many cases, CHAI3D and its related demos are used for benchmarking various haptic collision and rendering algorithms. However, CHAI3D is designed for off-the-shelf single-point haptic devices only, and it does not provide native support to customised multi-point haptic devices. In this paper, we aim to extend the existing CHAI3D framework and provide a standardized routine to support customised, single/multi-point haptic devices. Our extension aims at two issues: Intra-device communication and Inter-device communication. Therefore, our extension includes an HIP wrapper layer to concurrently handle multiple HIPs of a single device, and a communication layer to concurrently handle multiple position, orientation and force calculations of multiple haptic devices. Our extension runs on top of a custom-built 8-channel device controller, although other off-the shelf controllers can also be integrated easily. Our extension complies with the CHAI3D design framework and advanced provide inter-device communication capabilities for multi-device operations. With straightforward conversion routines, existing CHAI3D demos can be adapted to multi-point demos, supporting real-time parallel collision detection and force rendering.
  • Keywords
    haptic interfaces; rendering (computer graphics); CHAI3D; HIP wrapper layer; communication layer; custom-built 8-channel device controller; customised multipoint haptic devices; customised singlepoint haptic devices; force calculations; force rendering; haptic SDK; haptic collision; inter-device communication; intra-device communication; multipoint demos; off-the shelf controllers; off-the-shelf single-point haptic devices; open-source; real-time parallel collision detection; rendering algorithms; Collision avoidance; Force; Grasping; Hardware; Hip; Rendering (computer graphics); CHAI3D extension; intra and inter-device communication; multi-HIP wrapper; multi-point haptics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems, Man and Cybernetics (SMC), 2014 IEEE International Conference on
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/SMC.2014.6974192
  • Filename
    6974192