Title :
Use of mini heat pipes for the thermal management of high dissipative electronic packages
Author :
Zaghdoudi, M.C. ; Maalej, S. ; Tantolin, C. ; Sarno, C.
Author_Institution :
Unite de Rech. Mater. Mesures et Applic., Inst. Nat. des Sci. Appl. et de Technol., Tunis
Abstract :
An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrate are considered: alumina and FR4 epoxy substrates, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.
Keywords :
chip-on-board packaging; heat pipes; thermal management (packaging); card substrates; chip-on-board packaging; electronic packages; heat pipes; thermal management; Aerospace electronics; Electronic packaging thermal management; Electronics cooling; Heat sinks; Heat transfer; Space heating; Temperature; Thermal management; Thermal management of electronics; Water heating;
Conference_Titel :
Design and Technology of Integrated Systems in Nanoscale Era, 2008. DTIS 2008. 3rd International Conference on
Conference_Location :
Tozeur
Print_ISBN :
978-1-4244-1576-2
Electronic_ISBN :
978-1-4244-1577-9
DOI :
10.1109/DTIS.2008.4540211
