Microwave laminate PCB compatible RF MEMS technology for wireless communication systems

Author

Cetiner, B.A. ; Qian, J.Y. ; Chang, H.P. ; Bachman, M. ; Li, G.P. ; De Flaviis, F.

Author_Institution

California Univ., Irvine, CA, USA

Volume

1

fYear

2003

Firstpage

387

Abstract

The paper introduces state of the art microwave laminate printed circuit board (PCB) compatible RF MEMS technology for wireless communication systems. This technology is novel in that RF MEMS components, particularly RF MEM switches, can be fabricated on any PCB substrate and they can be monolithically integrated with antenna elements on the same substrate offering adaptability and reconfigurability features to the communication systems. The advantages of this technology in terms of overcoming critical drawbacks of existing RF MEMS technology are described. A three-element diversity antenna monolithically integrated with RF MEM switches on RT/Duroid5880 PCB is provided to establish a proof of concept for this technology. Results are presented and discussed.

Keywords

MMIC; antenna radiation patterns; microstrip antennas; microswitches; printed circuits; RF MEM switches; RT/Duroid5880 PCB; antenna radiation patterns; diversity antenna; microwave laminate PCB; microwave laminate printed circuit board; monolithic integration; wireless communication systems; Communication switching; Communications technology; Integrated circuit technology; Laminates; Microwave technology; Printed circuits; Radio frequency; Radiofrequency microelectromechanical systems; Switches; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2003. IEEE

Conference_Location

Columbus, OH, USA

Print_ISBN

0-7803-7846-6

Type

conf

DOI

10.1109/APS.2003.1217478

Filename

1217478