DocumentCode
173806
Title
2nd generation bilayer graphene transistors for applications in nanoelectronics
Author
Wessely, Authors P. J. ; Schwalke, Udo
Author_Institution
Inst. for Semicond. Technol. & Nanoelectron., Tech. Univ. Darmstadt, Darmstadt, Germany
fYear
2014
fDate
6-8 May 2014
Firstpage
1
Lastpage
3
Abstract
In this paper we report on in-situ CCVD grown bilayer graphene transistors (BiLGFETs) in a Silicon-CMOS compatible fabrication process. By means of catalytic chemical vapor deposition (CCVD) the BiLGFETs are realized directly on oxidized silicon substrate without transfer. These BiLGFETs possess unipolar p-type device characteristics with a high on/off-current ratio between 1×105 and 1×107 at room temperature [1, 2]. At this stage, the maximal on-state current of a BiLGFET is clearly influenced by the contact resistance. In order to improve the performance of the produced BiLGFETs, an advanced fabrication step has been developed, by which means the contact resistance is lowered by a factor of 10.
Keywords
CMOS integrated circuits; chemical vapour deposition; contact resistance; field effect transistor circuits; graphene; nanoelectronics; semiconductor growth; 2nd generation bilayer graphene transistors; BiLGFETs; catalytic chemical vapor deposition; contact resistance; in-situ CCVD grown bilayer graphene transistors; maximal on-state current; nanoelectronics; oxidized silicon substrate; silicon-CMOS compatible fabrication process; temperature 293 K to 298 K; unipolar p-type device characteristics; Contact resistance; Fabrication; Graphene; Palladium; Silicon; Surface treatment; Transistors; applications in nanoelectronics; bilayer graphene transistor; contact resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Design & Technology of Integrated Systems In Nanoscale Era (DTIS), 2014 9th IEEE International Conference On
Conference_Location
Santorini
Type
conf
DOI
10.1109/DTIS.2014.6850651
Filename
6850651
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