DocumentCode :
1738432
Title :
Die temperature monitoring of high pressure die casting
Author :
Kong, L.X. ; She, F.H. ; Nahavandi, S. ; Kouzani, A.Z.
Author_Institution :
Sch. of Eng. & Technol., Deakin Univ., Geelong, Vic., Australia
Volume :
3
fYear :
2000
fDate :
2000
Firstpage :
1756
Abstract :
The high pressure die casting (HPDC) process is normally referred to as the cold chamber process which solves the materials problem by separating the molten metal reservoir from the actuator for most of the process cycle. In this process, the thermal effects of molten metal flow in the die are a major factor in determining casting surface quality, die life, and many internal quality parameters such as porosity. Therefore, development of an effective technology to promptly evaluate the effect of changes in thermal process variables is vital to the quality control and improvement of productivity. Image processing technology has been applied to analyse the thermal images. The information is correlated to thermal energy stored in the die to develop a thermal control system and improve the quality of castings
Keywords :
casting; computerised monitoring; high-pressure techniques; image processing; metallurgical industries; process monitoring; quality control; temperature control; actuator; casting surface quality; cold chamber process; die life; die temperature monitoring; high pressure die casting; image processing technology; internal quality parameters; molten metal flow; molten metal reservoir; porosity; productivity; quality control; stored thermal energy; thermal control system; thermal effects; thermal image analysis; thermal process variables; Actuators; Die casting; Image processing; Inorganic materials; Productivity; Quality control; Reservoirs; Temperature measurement; Temperature sensors; Thermal factors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Systems, Man, and Cybernetics, 2000 IEEE International Conference on
Conference_Location :
Nashville, TN
ISSN :
1062-922X
Print_ISBN :
0-7803-6583-6
Type :
conf
DOI :
10.1109/ICSMC.2000.886363
Filename :
886363
Link To Document :
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