Title :
Copper interconnection lines: SARF characterization and lifetime test
Author :
Ciofi, C. ; Damlo, V. ; Neri, B.
Author_Institution :
University of Pisa
Keywords :
Artificial intelligence; Bonding; Copper; Electric resistance; Electromigration; Grain size; Lifetime estimation; Metallization; Substrates; Testing;
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
DOI :
10.1109/ESREF.1996.888207
