Examination of reflow resistance for copper frame SMD products

Author

Setoya, T. ; Matsuura, T. ; Furuta, K. ; Terui, Y. ; Seokawa, Y. ; Koike, S. ; Kishimura, Y.

Author_Institution

Toshiba Micro-elctronics Corporation

fYear

1996

fDate

1996

Firstpage

1799

Lastpage

1802

Keywords

Copper; Delamination; Inorganic materials; Iron; Moisture; Nickel; Packaging; Resins; Shearing; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on

Print_ISBN

0-7803-3369-1

Type

DOI

10.1109/ESREF.1996.888218

Filename

888218

Link To Document