Title :
Introduction of plastic encapsulated devices in systems operating under severe temperature conditions
Author :
Hernandez, R. ; Le Peuch, O. ; Parmentier, B. ; Vial, R.
Author_Institution :
Schlumberger Riboud Product Centre
Keywords :
Costs; Delamination; Electric shock; Failure analysis; Packaging machines; Plastics; Qualifications; Temperature distribution; Testing; Vibration measurement;
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
DOI :
10.1109/ESREF.1996.888251
