New microdischarge devices and arrays: flexible metal/polymer structures and Si pyramidal devices

Author

Park, Sung-Jin ; Wagner, Clark J. ; Eden, J. Gary

Author_Institution

Dept. of Electr. & Comput. Eng., Illinois Univ., Champaign, IL, USA

Volume

1

fYear

2000

fDate

2000

Firstpage

175

Abstract

We report recent progress in the fabrication and characteristics of planar microdischarge devices and arrays. Cylindrical devices fabricated in Si and having diameters of 200-400 μm, were first demonstrated in 1997. Since that time, our laboratory has focused on exploring the unique electrical and optical properties of these devices and designing new devices for targeted applications. We have developed a new device structure that results in flexible and yet robust arrays. Fabricated in a metal/polymer/metal film-layered structure, these devices have a total thickness of 30 μm,

Keywords

arrays; cathodes; silicon; thin film devices; vacuum microelectronics; 200 to 400 mum; 30 mum; Si; Si pyramidal devices; device structure; electrical properties; flexible metal/polymer structures; metal/polymer/metal film-layered structure; microdischarge arrays; microdischarge devices; optical properties; planar microdischarge devices; robust arrays; total thickness; vacuum microelectronics; Anodes; Cathodes; Dielectric devices; Optical arrays; Optical devices; Optical films; Polyimides; Polymers; Silicon; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE

Conference_Location

Rio Grande

ISSN

1092-8081

Print_ISBN

0-7803-5947-X

Type

conf

DOI

10.1109/LEOS.2000.890732

Filename

890732