Title :
An optical interconnection technology for multilayer printed circuit boards
Author_Institution :
IC C-LAB, Siemens AG, Paderborn, Germany
Abstract :
In order to make full use of next generation microprocessors operating with clock speeds of more than 1 GHz there is a great need for high-bandwidth off-chip interconnects. Electrical interconnects on conventional printed circuit boards which are characterized by a limited bandwidth and emission of and sensibility to electromagnetic radiation cannot provide the required performance. To overcome this bottleneck, optical interconnects can be used for realizing high-bandwidth and high-performance information channels within and between systems. Moreover, they are totally insensible to electromagnetic noise and of course they do not radiate themselves. After introducing the main technologies for realizing electrical-optical circuit printed circuit boards, the design process with its modeling and simulation tasks is addressed
Keywords :
integrated optoelectronics; optical interconnections; printed circuit accessories; printed circuit design; 1 GHz; bottleneck; clock speeds; conventional printed circuit boards; design process; electrical interconnects; electrical-optical circuit printed circuit boards; electromagnetic noise; electromagnetic radiation; high-bandwidth information channels; high-bandwidth off-chip interconnects; high-performance information channels; limited bandwidth; modeling; multilayer printed circuit boards; next generation microprocessors; optical interconnection technology; optical interconnects; simulation tasks; Bandwidth; Circuit noise; Clocks; Electromagnetic interference; Electromagnetic radiation; Integrated circuit interconnections; Microprocessors; Nonhomogeneous media; Optical interconnections; Printed circuits;
Conference_Titel :
Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
Conference_Location :
Rio Grande
Print_ISBN :
0-7803-5947-X
DOI :
10.1109/LEOS.2000.890760
