• DocumentCode
    1739940
  • Title

    Optoelectronic multi-chip modules based on imaging fiber bundle structures

  • Author

    Chiarulli, Donald M. ; Levitan, Steven P. ; Robinson, Mark ; Tatah, Karirn

  • Author_Institution
    Dept. of Comput. Sci., Pittsburgh Univ., PA, USA
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Abstract
    l present designs of optoelectronic multichip module (OE-MCM) structures with high connectively, and low latency designs for small, (three to seven) ensembles of chips. I will demonstrate multiple approaches for scaling these systems to large numbers of devices. I will also present several prototype systems that we have developed in our laboratory
  • Keywords
    multichip modules; optical design techniques; optical fibres; optical images; optical interconnections; high connectively; imaging fiber bundle structure; low latency designs; optoelectronic multi-chip modules; prototype systems; scaling; Circuits; Optical imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
  • Conference_Location
    Rio Grande
  • ISSN
    1092-8081
  • Print_ISBN
    0-7803-5947-X
  • Type

    conf

  • DOI
    10.1109/LEOS.2000.893894
  • Filename
    893894
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1739940