Title :
Optoelectronic multi-chip modules based on imaging fiber bundle structures
Author :
Chiarulli, Donald M. ; Levitan, Steven P. ; Robinson, Mark ; Tatah, Karirn
Author_Institution :
Dept. of Comput. Sci., Pittsburgh Univ., PA, USA
Abstract :
l present designs of optoelectronic multichip module (OE-MCM) structures with high connectively, and low latency designs for small, (three to seven) ensembles of chips. I will demonstrate multiple approaches for scaling these systems to large numbers of devices. I will also present several prototype systems that we have developed in our laboratory
Keywords :
multichip modules; optical design techniques; optical fibres; optical images; optical interconnections; high connectively; imaging fiber bundle structure; low latency designs; optoelectronic multi-chip modules; prototype systems; scaling; Circuits; Optical imaging;
Conference_Titel :
Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
Conference_Location :
Rio Grande
Print_ISBN :
0-7803-5947-X
DOI :
10.1109/LEOS.2000.893894
