Title :
Packaging consideration for 1 Gbps Si CMOS optical driver
Author :
Jung, Sungyong ; Brooke, Martin A. ; Jokerst, Nan Marie
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
A high speed laser driver circuit has been designed and fabricated with an on-chip decoupling capacitor to prevent output distortion from packaging parasitics. The suitability of a decoupling capacitor with a minimum capacitance of 7 nF was verified
Keywords :
CMOS analogue integrated circuits; SPICE; chip scale packaging; current mirrors; driver circuits; integrated optoelectronics; optical communication equipment; optical interconnections; 1 Gbit/s; 7 nF; CMOS optical driver; HSICE simulation; Si; current mirrors; current switch; differential design; high speed laser driver circuit; minimum capacitance; on-chip decoupling capacitor; optical interconnection; optoelectronic packaging; output distortion prevention; packaging parasitics model; CMOS technology; Diodes; Driver circuits; Laser beam cutting; Optical interconnections; Optical pulse generation; Packaging; Power supplies; Switches; Variable structure systems;
Conference_Titel :
Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
Conference_Location :
Rio Grande
Print_ISBN :
0-7803-5947-X
DOI :
10.1109/LEOS.2000.894137
