• DocumentCode
    1739987
  • Title

    Packaging consideration for 1 Gbps Si CMOS optical driver

  • Author

    Jung, Sungyong ; Brooke, Martin A. ; Jokerst, Nan Marie

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    882
  • Abstract
    A high speed laser driver circuit has been designed and fabricated with an on-chip decoupling capacitor to prevent output distortion from packaging parasitics. The suitability of a decoupling capacitor with a minimum capacitance of 7 nF was verified
  • Keywords
    CMOS analogue integrated circuits; SPICE; chip scale packaging; current mirrors; driver circuits; integrated optoelectronics; optical communication equipment; optical interconnections; 1 Gbit/s; 7 nF; CMOS optical driver; HSICE simulation; Si; current mirrors; current switch; differential design; high speed laser driver circuit; minimum capacitance; on-chip decoupling capacitor; optical interconnection; optoelectronic packaging; output distortion prevention; packaging parasitics model; CMOS technology; Diodes; Driver circuits; Laser beam cutting; Optical interconnections; Optical pulse generation; Packaging; Power supplies; Switches; Variable structure systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
  • Conference_Location
    Rio Grande
  • ISSN
    1092-8081
  • Print_ISBN
    0-7803-5947-X
  • Type

    conf

  • DOI
    10.1109/LEOS.2000.894137
  • Filename
    894137
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1739987