• DocumentCode
    1740215
  • Title

    DC power bus design with FDTD modeling including a dispersive media

  • Author

    Ye, Xiaoning ; Fan, Jun ; Koledintseva, Marina ; Drewniak, James L.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    55
  • Lastpage
    58
  • Abstract
    DC power-bus modeling in high-speed digital design using the FDTD method is reported here. The dispersive medium is approximated by a Debye model to account for the loss. A wide band frequency response (100 MHz-5 GHz) is obtained through a single FDTD simulation. Favorable agreement is achieved between the modeled and measured results for a typical DC power-bus structure with multiple SMT decoupling capacitors mounted on the board. The FDTD tool is then applied to investigate the effects of local decoupling on a DC power-bus. The modeled results agree with the results from another modeling tool, the CEMPIE (a circuit extraction approach based on a mixed-potential integral equation formulation) method
  • Keywords
    capacitors; digital circuits; dispersive media; finite difference time-domain analysis; frequency response; integral equations; power supply circuits; printed circuit design; surface mount technology; 100 MHz to 5 GHz; CEMPIE method; DC power bus design; DC power-bus; DC power-bus modeling; DC power-bus structure; Debye model; FDTD method; FDTD modeling; FDTD simulation; FDTD tool; circuit extraction; dispersive media; dispersive medium Debye mode approximation; high-speed digital design; local decoupling; loss; mixed-potential integral equation formulation; modeling tool; multiple SMT decoupling capacitors; wide band frequency response; Capacitors; Coaxial cables; Dispersion; Electromagnetic compatibility; Finite difference methods; Noise reduction; Resonant frequency; Surface-mount technology; Testing; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    0-7803-6450-3
  • Type

    conf

  • DOI
    10.1109/EPEP.2000.895492
  • Filename
    895492