Title :
Contact-pad design for high-frequency silicon measurements
Author :
Williams, Dylan F. ; Byers, Andrew C. ; Tyre, Vance C. ; Walker, David K. ; Ou, Jeffrey J. ; Jin, Xiaodong ; Piket-May, Melinda ; Hu, Chenming
Author_Institution :
Nat. Inst. of Stand. & Technol., Boulder, CO, USA
Abstract :
We measure and compare the electrical parasitics of contact pads of different designs fabricated on silicon integrated circuits and develop a strategy for reducing the parasitics. We used an on-wafer probe system calibrated with the multiline through-reflect-line (TRL) probe-tip calibration
Keywords :
calibration; electrical contacts; elemental semiconductors; integrated circuit interconnections; integrated circuit measurement; integrated circuit noise; integrated circuit packaging; probes; silicon; Si; contact pad; contact pad design; contact-pad design; electrical parasitics; high-frequency silicon measurements; multiline TRL probe-tip calibration; multiline through-reflect-line probe-tip calibration; on-wafer probe system; parasitics reduction; silicon integrated circuits; Calibration; Capacitance measurement; Contacts; Coplanar waveguides; Electric variables measurement; Integrated circuit measurements; Microstrip; Parasitic capacitance; Signal design; Silicon;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895510
