Interconnect electromagnetic modeling using conduction modes as global basis functions

Author

Daniel, Luca ; Sangiovanni-Vincentelli, Alberto ; White, Jacob

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA

fYear

2000

fDate

2000

Firstpage

203

Lastpage

206

Abstract

A new method is formulated for modeling current distributions inside conductors for a quasi-static or a full-wave electromagnetic field simulator. In our method, we model current distributions inside interconnects using a small number of conduction modes as global basis functions for discretization of the mixed potential integral equation. A very simple example is presented to illustrate the potential of our method

Keywords

current distribution; electromagnetic field theory; integral equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; printed circuits; conduction modes; conductors; current distribution; current distribution modeling; full-wave electromagnetic field simulator; global basis functions; interconnect electromagnetic modeling; interconnects; mixed potential integral equation; mixed potential integral equation discretization; modeling; quasi-static electromagnetic field simulator; Conductors; Current distribution; Differential equations; Electromagnetic modeling; Integral equations; Integrated circuit interconnections; Jacobian matrices; Magnetic analysis; Printed circuits; Surface impedance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895528

Filename

895528