Title :
Enhanced transmission characteristics of on-chip interconnects with orthogonal gridded shield
Author :
Lutz, R.D. ; Tripathi, V.K. ; Wiesshaar, A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
On-chip interconnects over an orthogonal grid of grounded lines on a silicon substrate are characterized by full-wave electromagnetic simulation. It is demonstrated that the shielding structure significantly enhances the transmission characteristics of on-chip interconnects. An equivalent circuit model for the shielded interconnects is also presented
Keywords :
circuit simulation; electromagnetic interference; electromagnetic shielding; electromagnetic wave transmission; equivalent circuits; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; enhanced transmission characteristics; equivalent circuit model; full-wave electromagnetic simulation; grounded lines; on-chip interconnects; orthogonal grid; orthogonal gridded shield; shielded interconnects; shielding structure; silicon substrate; transmission characteristics; CMOS technology; Capacitance; Conductivity; Conductors; Equivalent circuits; Frequency; Inductance; Integrated circuit interconnections; Q factor; Silicon;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895556
