• DocumentCode
    1740576
  • Title

    Effects of discrete blood vessels in ultrasound interstitial heating from FEA modeling

  • Author

    Jarosz, B.J.

  • Author_Institution
    Ottawa-Carleton Inst. for Phys., Carleton Univ., Ottawa, Ont., Canada
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    801
  • Abstract
    In this presentation, the authors report modeling heating of tissue with ultrasound interstitial applicator array. Their 3-D FEA computation of heating patterns due to four-applicator array evaluates effects of discrete blood vessels around the applicators in brain tissue. In the modeling, the number of blood vessels around an applicator varied from three to six. Several sizes of blood vessels are discussed. The smallest and the largest vessels were of 0.367 and 1.1 mm average diameter. The authors considered also a bed of vessels of mixed size. They found that small vessels in vicinity of the applicators do not influence significantly the heating patterns. Temperature around them remains high enough to cause their denaturation. The large blood vessels at the periphery of treatment region reduce substantially the region both in the radial direction from the array center and in the axial direction at the region center
  • Keywords
    biomedical ultrasonics; blood vessels; finite element analysis; hyperthermia; physiological models; radiation therapy; 0.367 mm; 1.1 mm; FEA modeling; array center; axial direction; brain tissue; denaturation; heating patterns; large blood vessels; mixed size vessels bed; radial direction; region center; therapeutic ultrasound; thermal therapy; treatment region periphery; ultrasonic heating; ultrasound interstitial heating; Applicators; Blood flow; Blood vessels; Equations; Field emitter arrays; Heating; Instruments; Medical treatment; Temperature; Ultrasonic imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2000. Proceedings of the 22nd Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-6465-1
  • Type

    conf

  • DOI
    10.1109/IEMBS.2000.897835
  • Filename
    897835