Title :
Transdermal ballistic delivery of micro-particles: investigation into skin penetration
Author :
Kendall, M.A.F. ; Smith, P. J Wrighton ; Bellhouse, B.J.
Author_Institution :
Dept. of Eng., Oxford Univ., UK
Abstract :
This paper describes investigations into the impact of model micro-particles into excised human skin. This work is aimed at optimising a unique form of transdermal drug delivery, based on PowderJect(R) devices. These devices work by accelerating drugs in micro-particle form to a velocity at which they will enter the skin. Not only are PowderJect(R) devices painless and needle-free; by the manipulation of penetration depth, existing therapeutic compounds can be made to work much more effectively. A research device was designed to deliver particles to the skin at conditions with nominally uniform velocities. Glass, polystyrene and steel micro-spheres were used to simulate drug payloads. The results of these investigations show that penetration depth into skin is a function of particle density, radius and entry velocity. This relationship provides a criterion for the optimal selection of particle parameters and entry velocity to target specific layers within the skin. The experimental data is compared to both a theoretical and an empirical model with good agreement
Keywords :
ballistics; drug delivery systems; glass; impact (mechanical); particle size; polymers; skin; steel; PowderJect devices; drug acceleration; drug payloads; empirical model; entry velocity; excised human skin; glass micro-spheres; micro-particles; nominally uniform velocities; optimal selection; particle density; particle parameters; particle radius; penetration depth; polystyrene micro-spheres; research device; skin penetration; steel micro-spheres; therapeutic compounds; transdermal ballistic delivery; transdermal drug delivery; velocity; Acceleration; Drug delivery; Glass; Humans; Payloads; Pharmaceutical technology; Pistons; Skin; Steel; Vaccines;
Conference_Titel :
Engineering in Medicine and Biology Society, 2000. Proceedings of the 22nd Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-6465-1
DOI :
10.1109/IEMBS.2000.900385