• DocumentCode
    1741295
  • Title

    The use of electrical impedance tomography with the inverse problem of EEG and MEG

  • Author

    Goncalves, S. ; de Munck, J.C.

  • Author_Institution
    MEG Center, Univ. Hospital Vrije Univ., Amsterdam, Netherlands
  • Volume
    3
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    2346
  • Abstract
    This study demonstrates the theoretical feasibility of the EIT method to estimate the equivalent electrical conductivities of brain, skull and scalp. On the other hand, it clearly shows that the presented method has the ability to compute equivalent electrical conductivities which compensate for errors committed on the geometry of the head. The use of the EIT estimated conductivities in the solution of the EEG inverse problem (IP) with a wrong head geometry proved to be effective in the decrease of the systematic errors of the dipole position. Also the use of EIT estimated conductivities in the solution of the EEG IP instead of conductivities affected with errors also improves, in general, the dipole position error. It is concluded that the method is not efficient in improving the dipole strength error. It is therefore demonstrated that the combination of EIT and EEG has the potential to reduce systematic errors in estimating the underlying generators of the EEG
  • Keywords
    electric impedance imaging; electroencephalography; error compensation; inverse problems; magnetoencephalography; medical signal processing; EEG; MEG; brain; dipole position error; electrical impedance tomography use; equivalent electrical conductivities; error compensation; forward problem; inverse problem; scalp; skull; Brain modeling; Conductivity; Electric variables measurement; Electrodes; Electroencephalography; Impedance; Inverse problems; Magnetic field measurement; Magnetic heads; Tomography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2000. Proceedings of the 22nd Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-6465-1
  • Type

    conf

  • DOI
    10.1109/IEMBS.2000.900615
  • Filename
    900615