• DocumentCode
    1742169
  • Title

    Micro-assembly for top-down nanotechnology

  • Author

    Skidmore, George D. ; Ellis, Matthew ; Parker, Eric ; Sarkar, Neil ; Merkle, Ralph

  • Author_Institution
    Zyvex, Richardson, TX, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    3
  • Lastpage
    9
  • Abstract
    A top-down assembly approach to nanotechnology starting with parts using MEMS techniques is presented. MEMS components, built with integrated circuit manufacturing processes, can be used to fabricate complex parts with integrated functionality. These parts can be used in assemblies at the micron length scale and above. To pursue assemblies of this type certain developments are necessary to constrain parts until needed, mechanically and electrically couple parts, and handle parts. A system architecture, scalable to smaller sizes, for assembling such parts in exponential and massively parallel manners is presented. Some progress towards these developments has been made by demonstrations of reversible positional component tethering and reversible positional mechanical coupling
  • Keywords
    LIGA; etching; microassembling; micromachining; micromechanical devices; micropositioning; moulding; nanotechnology; LIGA; MEMS techniques; MUMPS; complex parts; deep etching; exponential assembly; integrated circuit manufacturing processes; integrated functionality; microassembly; micromachining; molded polysilicon HEXSIL; reversible positional component tethering; reversible positional mechanical coupling; system architecture; top-down assembly approach; top-down nanotechnology; Assembly systems; Buildings; Coupling circuits; Integrated circuit manufacture; Manufacturing; Micromechanical devices; Nanobioscience; Nanotechnology; Production; Self-assembly;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micromechatronics and Human Science, 2000. MHS 2000. Proceedings of 2000 International Symposium on
  • Conference_Location
    Nagoya
  • Print_ISBN
    0-7803-6498-8
  • Type

    conf

  • DOI
    10.1109/MHS.2000.903276
  • Filename
    903276