DocumentCode
1742169
Title
Micro-assembly for top-down nanotechnology
Author
Skidmore, George D. ; Ellis, Matthew ; Parker, Eric ; Sarkar, Neil ; Merkle, Ralph
Author_Institution
Zyvex, Richardson, TX, USA
fYear
2000
fDate
2000
Firstpage
3
Lastpage
9
Abstract
A top-down assembly approach to nanotechnology starting with parts using MEMS techniques is presented. MEMS components, built with integrated circuit manufacturing processes, can be used to fabricate complex parts with integrated functionality. These parts can be used in assemblies at the micron length scale and above. To pursue assemblies of this type certain developments are necessary to constrain parts until needed, mechanically and electrically couple parts, and handle parts. A system architecture, scalable to smaller sizes, for assembling such parts in exponential and massively parallel manners is presented. Some progress towards these developments has been made by demonstrations of reversible positional component tethering and reversible positional mechanical coupling
Keywords
LIGA; etching; microassembling; micromachining; micromechanical devices; micropositioning; moulding; nanotechnology; LIGA; MEMS techniques; MUMPS; complex parts; deep etching; exponential assembly; integrated circuit manufacturing processes; integrated functionality; microassembly; micromachining; molded polysilicon HEXSIL; reversible positional component tethering; reversible positional mechanical coupling; system architecture; top-down assembly approach; top-down nanotechnology; Assembly systems; Buildings; Coupling circuits; Integrated circuit manufacture; Manufacturing; Micromechanical devices; Nanobioscience; Nanotechnology; Production; Self-assembly;
fLanguage
English
Publisher
ieee
Conference_Titel
Micromechatronics and Human Science, 2000. MHS 2000. Proceedings of 2000 International Symposium on
Conference_Location
Nagoya
Print_ISBN
0-7803-6498-8
Type
conf
DOI
10.1109/MHS.2000.903276
Filename
903276
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