Micro connector fabricated by micro process technology

Author

Bhuiyan, M.M.I. ; Unno, Toshinori ; Yokoyama, Yoshihiko ; Toriyama, Toshiyuki ; Sugiyama, Shunsuke

Author_Institution

Fac. of Sci. & Eng., Ritsumeikan Univ., Shiga, Japan

fYear

2000

fDate

2000

Firstpage

83

Lastpage

88

Abstract

A fork-type micro connector with high aspect ratio and high package density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB-138N) was used as a mold of Ni electroforming. The tips of plug terminal of the micro connector were formed as movable portions using Cu sacrificial layer etching. In order to make firm contact and precise connection of the micro connector, two-step guidance was adopted. The size of the terminal of fabricated micro connector was 50 μm-thickness and 15 μm-width (minimum). The maximum aspect ratio of the fabricated micro connector is 3.3 and the terminal pitch is 80 μm. A contact resistance of approximately 50 mΩ was obtained by using four-point probe method

Keywords

contact resistance; electric connectors; electroforming; etching; micromachining; micromechanical devices; moulding; photoresists; ultraviolet lithography; 15 micron; 50 micron; 50 mohm; Ni; UV thick photoresist; contact resistance; firm contact; fork-type microconnector; four-point probe method; high aspect ratio; high package density; high-density packaging; housing design; micro process technology; microfabrication; movable portions; negative photoresist mold; nickel electroforming; plug terminal tips; precise connection; sacrificial layer etching; two-step guidance; Connectors; Contacts; Electron devices; Injection molding; Manufacturing; Packaging; Plugs; Pressing; Resists; Sockets;

fLanguage

English

Publisher

ieee

Conference_Titel

Micromechatronics and Human Science, 2000. MHS 2000. Proceedings of 2000 International Symposium on

Conference_Location

Nagoya

Print_ISBN

0-7803-6498-8

Type

conf

DOI

10.1109/MHS.2000.903295

Filename

903295