Experimental and numerical analyses of flip-chip attach reliability

Reliability and functionality of microelectronics products utilizing advanced packaging approaches, e.g. flip chip interconnection technology, chip scale or wafer level packaging, largely depend on their mechanical and thermal constitution. Thermo-mechanical aspects of component and system reliability become increasingly important with growing miniaturization as the local physical parameters and field quantities show an increase in sensitivity due to inhomogeneities in local stresses, strains and temperature fields. Since there is usually a lack of information about the local material parameters, a pure field simulation cannot, as a rule, solve the problem. The state of the art of electronic packaging design increasingly requires direct “coupling” between simulation tools (including e.g. FE modeling) and advanced physical experiments