Development of environmental friendly (green), thermally enhanced mold compound (TEMC) for advanced packages

This paper outlines the development and performance of a new series of mold compounds with thermal conductivity (λ) up to 100×10^-4 cal/cm·s·C (4.2 W/m·K). The alumina and mixture of aluminum nitride and alumina filled mold compound feature a coefficient of thermal expansion of ~10 ppm/K, low warpage with one-side molded BGAs and good anti-solder cracking performance. Being “green”, these halogen and antimony free encapsulants are able to pass high temperature storage life (HTSL) tests at 175°C for more than 1000 hrs. These features are made possible with use of optimum combinations of a carefully selected filler system (up to ~80vol%), epoxy resin system, latent catalyst and new “green” compound technology. Thermal performance indices such as θ_ja values at board level are currently being measured