The study on the novel lead-free solder alloy

Author

Le, Huang ; Qian, Wang ; Jusheng, Ma

Author_Institution

Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China

fYear

2000

fDate

2000

Firstpage

191

Lastpage

193

Abstract

Sn-Pb solders are widely used in the electronics industry, but lead is to be restricted due to its toxicity. The properties of Sn-Ag-Cu and Sn-Ag-Zn system solder alloys are studied in this paper. The melting points of the solders are measured by DSC821^e scan calorimeter and the hardness and solderability are also measured. The results show that the addition of small amounts of Cu or Zn into the Sn-Ag eutectic solders brings an increase in strength and solderability and the melting ranges only expand a little. Comparison of the results shows a perfect composition for the lead free solder

Keywords

assembling; copper alloys; differential scanning calorimetry; environmental factors; hardness; health hazards; mechanical strength; melting point; packaging; silver alloys; tin alloys; zinc alloys; Sn-Ag eutectic solders; Sn-Ag-Cu system solder alloys; Sn-Ag-Zn system solder alloys; Sn-Pb solders; SnAgCu; SnAgZn; SnPb; electronics industry; hardness; lead free solder; lead toxicity; lead-free solder alloy; mechanical strength; melting point; scan calorimeter; solderability; Chemical elements; Copper; Electronics industry; Environmentally friendly manufacturing techniques; Lead compounds; Mechanical factors; Pollution measurement; Soldering; Temperature measurement; Zinc;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on

Conference_Location

Hong Kong

Print_ISBN

0-7803-6654-9

Type

conf

DOI

10.1109/EMAP.2000.904152

Filename

904152