DocumentCode
1742490
Title
Effect of moisture on the curing behaviour of underfills
Author
Chian, K.S. ; Lim, S.H. ; Yi, S. ; Chen, William T.
Author_Institution
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
fYear
2000
fDate
2000
Firstpage
289
Lastpage
296
Abstract
This paper describes the curing, processing and thermomechanical behaviours of an anhydride-cured liquid epoxy based underfill polymer that was contaminated with water. Water was added to the uncured underfill system using two different routes, simulating two possible ways in which the underfill resin can be contaminated. In the first case, known amounts of water were added directly to a fully-formulated underfill, whilst in the second case, water was added to the epoxy resin prior to formulating the underfill system. The effects of the added water were studied using Fourier transform infrared (FTIR) spectra, differential scanning calorimetry (DSC), dynamic mechanical analyser (DMA) and light microscopy. This study shows that the presence of water resulted in rapid hydrolysis of the anhydride hardener to form solid crystalline carboxylic acid. It was found that the major cause of the flow disturbances during underfilling and deterioration in the final properties of the underfill was closely related to the occurrence of the carboxylic acid. Direct contamination of the formulated underfill was found to have the greatest impact on the material processing and thermomechanical properties
Keywords
Fourier transform spectra; differential scanning calorimetry; encapsulation; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; microassembling; moisture; optical microscopy; surface contamination; DMA; DSC; FTIR spectra; Fourier transform infrared spectra; H2O; anhydride hardener; anhydride-cured liquid epoxy based underfill polymer; carboxylic acid; curing behaviour; differential scanning calorimetry; direct contamination; dynamic mechanical analyser; epoxy resin; flow disturbance; fully-formulated underfill; hydrolysis; light microscopy; material processing; moisture effects; processing behaviour; solid crystalline carboxylic acid; thermomechanical behaviour; thermomechanical properties; uncured underfill system; underfill properties deterioration; underfill resin; underfill system; underfilling; underfills; water addition; water contamination; Calorimetry; Curing; Epoxy resins; Fourier transforms; Infrared spectra; Microscopy; Moisture; Polymers; Thermomechanical processes; Water pollution;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on
Conference_Location
Hong Kong
Print_ISBN
0-7803-6654-9
Type
conf
DOI
10.1109/EMAP.2000.904169
Filename
904169
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