Design and estimation of embedded passives in multiple line grid array (MLGA) package

The MLGA package has been newly introduced as a future high-density and high-speed package method, developed by Glotech Inc. The properties and electrical characteristics of the MLGA package have been studied previously (Seungyoung Ahn et al, 2000). The MLG is fabricated using a multi-layered glass ceramic substrate structure. The ceramic MLG is made using low-temperature co-fired ceramic (LTCC) processes. Based on the multi-layered MLG process, the MLG works not only as a high-density bonding method, but also can integrate embedded passive devices such as capacitors, inductors and resistors. In this paper, we introduce the MLGA package and the electrical equivalent circuit model. Furthermore, the design examples and the estimated values of the embedded passives integrated into the MLG are shown. According to the simulation results, capacitors of 138.6 pF and inductors of 236.6 nH can be embedded into an MLG of 1 mm height. Also, applications of the embedded passives to decoupling capacitors and low-pass filters (LPF) are discussed. Significant reduction of the simultaneous switching noise is demonstrated using the embedded decoupling capacitors. LPFs with 100 MHz and 300 MHz 3 dB cut-off frequencies are demonstrated. These evaluations are based on the extracted model of the MLGA package from microwave S-parameter measurements and based on the simulated parameters of the embedded passives