Title :
Application of Py-GC/MS in electronic packaging industry for monitoring curing processes of EMCs
Author :
Xu, Yijin ; Teng, Annette
Author_Institution :
EPACK Lab., Hong Kong Univ. of Sci. & Technol., Kowloon, China
Abstract :
Evolved gas analysis-gas chromatography/mass spectrometry (EGA-GC/MS), EGA sampling, single-shot pyrolysis, and double-shot pyrolysis techniques were used to analyze the curing and degradation processes of four commercial epoxy molding compounds (EMCs). EGA-GC/MS curves of the EMCs provides clear information about the volatile components produced during the curing process, making selective analysis of the volatile components possible. EGA sampling, single-shot and double-shot pyrolysis analyses of the EMCs showed that during the curing process, low molar mass components such as catalysts and accelerators could be vaporized out due to the thermal environments; the heating rate and pre-cure temperature can have major effects on the evolution of low molar mass components. The potential uses of these techniques in the electronic packaging industry are also discussed
Keywords :
catalysts; chromatography; encapsulation; heat treatment; mass spectroscopic chemical analysis; moulding; plastic packaging; polymers; pyrolysis; EGA sampling; EGA-GC/MS; EGA-GC/MS curves; EMCs; Py-GC/MS; accelerators; catalysts; curing; curing process; curing processes; degradation processes; double-shot pyrolysis; electronic packaging; electronic packaging industry; epoxy molding compounds; evolved gas analysis-gas chromatography/mass spectrometry; heating rate; low molar mass components; monitoring; pre-cure temperature; selective analysis; single-shot pyrolysis; thermal environments; vaporization; volatile components; Curing; Degradation; Electromagnetic compatibility; Electronic packaging thermal management; Electronics industry; Electronics packaging; Heating; Information analysis; Mass spectroscopy; Sampling methods;
Conference_Titel :
Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-6654-9
DOI :
10.1109/EMAP.2000.904194