Title :
Sintering process of low temperature cofired ceramics
Author :
Han, Z. ; Ma, J. ; Xu, Z. ; Wang, Q. ; Huang, L. ; Li, Y.
Author_Institution :
Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
Abstract :
In order to research the mismatch shrinkage between a package substrate and metal lines, this paper studies the sintering densification process of low temperature cofired glass ceramics. At different phases, the substrate has different shrinkage features: at 0-600°C, it shows almost no shrinkage, but it shrinks dramatically from 600°C to 900°C, by as much as 25%. Furthermore, through calculation of the sintering activation energy, we can conclude that it is the liquid-sintering-mechanism of glass that plays an important role in the sintering process. This work can help to optimize the sintering technology
Keywords :
ceramic packaging; densification; glass ceramics; integrated circuit packaging; optimisation; shrinkage; sintering; glass liquid-sintering-mechanism; low temperature cofired ceramics; low temperature cofired glass ceramics; metal lines; mismatch shrinkage; package substrate; sintering activation energy; sintering densification process; sintering process; sintering technology optimization; substrate phases; substrate shrinkage features; Additives; Ceramics; Dielectric materials; Dielectric substrates; Glass; Packaging; Powders; Solvents; Temperature; Thermal expansion;
Conference_Titel :
Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-6654-9
DOI :
10.1109/EMAP.2000.904195
