DocumentCode
1743086
Title
Manufacturability and reliability of non-halogenated molding compounds
Author
Cada, L.G. ; Lalanto, R. ; Coronel, G. ; Gregorio, N. San ; Asis, D. ; Ong, G. ; Ducusin, C. ; Desengano, R. ; Llamas, T. ; Decena, R. ; Canares, N. ; Reyes, A. ; Miciano, P.
Author_Institution
On Semiconduct., Cavite, Philippines
fYear
2000
fDate
2000
Firstpage
15
Lastpage
20
Abstract
In an effort to answer the global call for “green technology”, On Semiconductor Philippines Inc., has evaluated and qualified molding encapsulants (green molding compounds, GMCs) which do not contain the conventional halogenated flame-retardant. In this study, the tested resin formulations which are based on biphenyl, ortho-cresol novolac and/or dicyclopentadienyl epoxies contain either magnesium hydroxide or phosphorous as flame-retardant. Thermogravimetric analysis revealed higher thermal stability of these GMCs as compared to their halogenated counterparts. Adhesion of some of the GMCs to Ni/Pd/Au-plated leadframes was found to be stronger than adhesion of the halogenated molding compounds. Process parameters for molding of GMCs and nonGMCs into SOIC (small outline integrated chip) and TSSOP (thin shrunk small outline package) were comparable. Test samples passed the normal reliability tests conducted for analog devices. The more stringent oil immersion test at 260°C has qualified the phosphorous-containing biphenyl-based epoxy resin for TSSOP and the magnesium hydroxide-based GMC for the SOIC. This paper reports the results of the characterization, the evaluation and qualification study conducted for the different GMCs
Keywords
adhesion; encapsulation; environmental factors; flameproofing; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; moulding; plastic packaging; polymer films; thermal analysis; thermal stability; 260 C; GMC qualification; GMCs; Mg(OH)2; Ni-Pd-Au; Ni/Pd/Au-plated leadframes; P; SOIC; TSSOP; adhesion; analog devices; biphenyl epoxies; dicyclopentadienyl epoxies; green molding compounds; green technology; halogenated flame-retardant; halogenated molding compounds; magnesium hydroxide flame-retardant; magnesium hydroxide-based GMC; manufacturability; molding encapsulant; molding process parameters; nonhalogenated molding compounds; oil immersion test; ortho-cresol novolac epoxies; phosphorous flame-retardant; phosphorous-containing biphenyl-based epoxy resin; reliability; reliability tests; resin formulations; small outline integrated chip; thermal stability; thermogravimetric analysis; thin shrunk small outline package; Adhesives; Magnesium compounds; Manufacturing; Packaging; Petroleum; Resins; Semiconductor device manufacture; Stability analysis; Testing; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN
0-7803-6644-1
Type
conf
DOI
10.1109/EPTC.2000.906343
Filename
906343
Link To Document