Chemical imaging of micro-vias in organic packages

Author

Khong, Yoon Loong ; Lee, Hooi Ling

Author_Institution

Mater. Dept., Intel Technol. Malaysia, Penang, Malaysia

fYear

2000

fDate

2000

Firstpage

154

Lastpage

158

Abstract

Distribution of chemical species in cross sectioned micro-vias were observed using time-of-flight secondary ion mass spectroscopy (TOF-SIMS). TOF-SIMS combines high molecular and elemental detection sensitivities and good lateral resolution for detection of molecular and elemental content in the micro-via and surrounding structures of the flip-chip-pin-grid array packages (FC-PGA) fabricated from several sources. The data obtained indicate that it is feasible to compare and monitor organic package fabrication processes using TOF-SIMS chemical images

Keywords

flip-chip devices; integrated circuit interconnections; integrated circuit manufacture; integrated circuit packaging; mass spectroscopic chemical analysis; process monitoring; sensitivity; time of flight mass spectra; FC-PGA; TOF-SIMS; TOF-SIMS chemical images; chemical imaging; chemical species distribution; cross sectioned micro-vias; elemental content detection; elemental detection sensitivity; flip-chip-pin-grid array packages; lateral resolution; micro-vias; molecular content detection; molecular detection sensitivity; organic package fabrication processes; organic packages; time-of-flight secondary ion mass spectroscopy; Chemical elements; Chemical industry; Chemical technology; Chemistry; Copper; Dielectrics; Optical device fabrication; Organic chemicals; Packaging; Spatial resolution;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd

Print_ISBN

0-7803-6644-1

Type

conf

DOI

10.1109/EPTC.2000.906365

Filename

906365