Thick-films beyond the 1 GHz barrier

Author

Dziurdzia, Barbara ; Nowak, Stanblaw

Author_Institution

Dept. of Electron., Univ. of Min. & Metall., Cracow, Poland

Volume

1

fYear

2000

fDate

2000

Firstpage

31

Abstract

Thick-film technology has shown significant progress in interconnection density using photopatterning technology, lower dielectric constant and lower loss dielectrics, higher conductivity conductors and buried resistors and capacitors integral with the substrate. These advances coupled with thermal and reliability advantages of thick-films have created a new generation of thick-film technology suitable for many microwave designs. The paper reviews new thick-film materials and processes developed to extend the capability of conventional MCM-C technology in microwave applications

Keywords

microwave technology; thick film capacitors; thick film resistors; MCM-C technology; buried resistors; dielectric constant; higher conductivity conductors; integral capacitors; interconnection density; lower loss dielectrics; microwave applications; photopatterning technology; substrate; thick-film technology; Capacitors; Conducting materials; Conductivity; Dielectric constant; Dielectric losses; Dielectric materials; Dielectric substrates; Microwave generation; Microwave technology; Resistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwaves, Radar and Wireless Communications. 2000. MIKON-2000. 13th International Conference on

Conference_Location

Wroclaw

Print_ISBN

83-906662-3-5

Type

conf

DOI

10.1109/MIKON.2000.913868

Filename

913868