Title :
Thick-films beyond the 1 GHz barrier
Author :
Dziurdzia, Barbara ; Nowak, Stanblaw
Author_Institution :
Dept. of Electron., Univ. of Min. & Metall., Cracow, Poland
Abstract :
Thick-film technology has shown significant progress in interconnection density using photopatterning technology, lower dielectric constant and lower loss dielectrics, higher conductivity conductors and buried resistors and capacitors integral with the substrate. These advances coupled with thermal and reliability advantages of thick-films have created a new generation of thick-film technology suitable for many microwave designs. The paper reviews new thick-film materials and processes developed to extend the capability of conventional MCM-C technology in microwave applications
Keywords :
microwave technology; thick film capacitors; thick film resistors; MCM-C technology; buried resistors; dielectric constant; higher conductivity conductors; integral capacitors; interconnection density; lower loss dielectrics; microwave applications; photopatterning technology; substrate; thick-film technology; Capacitors; Conducting materials; Conductivity; Dielectric constant; Dielectric losses; Dielectric materials; Dielectric substrates; Microwave generation; Microwave technology; Resistors;
Conference_Titel :
Microwaves, Radar and Wireless Communications. 2000. MIKON-2000. 13th International Conference on
Conference_Location :
Wroclaw
Print_ISBN :
83-906662-3-5
DOI :
10.1109/MIKON.2000.913868
