Title :
Deposition of device-quality amorphous and microcrystalline silicon films with a new “hot wire” CVD technique
Author :
Morrison, Scott ; Madan, Arun
Author_Institution :
MVSyst. Inc., Golden, CA, USA
Abstract :
For the “Hot Wire” chemical vapor deposition technique (HWCVD) method to be a viable approach for photovoltaic applications, certain critical technical issues need to be addressed and resolved such as filament lifetime, reproducibility, and the ability to scale the technique to large area substrates. We have developed a new approach (patent applied for) that addresses some of these problems, specifically longevity of the filaments and reproducibility of the materials produced. The new filament material used has so far shown no appreciable degradation even after deposition of 500 μm of amorphous silicon (a-Si). We report that this technique can produce “state of-the-art” a-Si and that a solar cell of p/i/n configuration exhibited an initial efficiency approaching 9%. The development of microcrystalline silicon materials and devices is also discussed, and we report on large area materials development (30 cm×30 cm) using this technique
Keywords :
CVD coatings; amorphous semiconductors; chemical vapour deposition; elemental semiconductors; semiconductor growth; semiconductor thin films; silicon; solar cells; substrates; 30 cm; 500 mum; 9 percent; Hot Wire chemical vapor deposition technique; Si; amorphous silicon; amorphous silicon films; device-quality silicon films; filament lifetime; filaments longevity; large area substrates; materials reproducibility; microcrystalline silicon films; p/i/n configuration solar cell; photovoltaic applications; state of-the-art; technical issues; Amorphous materials; Amorphous silicon; Chemical vapor deposition; Fabrication; Photovoltaic cells; Reproducibility of results; Semiconductor films; Substrates; Temperature; Wire;
Conference_Titel :
Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE
Conference_Location :
Anchorage, AK
Print_ISBN :
0-7803-5772-8
DOI :
10.1109/PVSC.2000.916013