Development of no-flow underfill based on non-anhydride curing system

Author

Zhang, Zhuqing ; Fan, Lianhua ; Wong, C.P.

Author_Institution

Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2001

fDate

2001

Firstpage

251

Lastpage

256

Abstract

Most no-flow underfill materials are based on epoxy/anhydride chemistry. Due to the its sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using a nonanhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in terms of their curing behavior, thermo-mechanical properties and reliability. Compared with anhydride cured epoxy resins, epoxy/phenolic resins show high adhesion, high fracture toughness, low crosslinking density and high viscosity. The assembly with nonanhydride underfill shows high reliability during the thermal shock test. Using an appropriate fluxing agent, no-flow underfills based on epoxy/phenolic system have been developed

Keywords

adhesion; encapsulation; flip-chip devices; fracture toughness; heat treatment; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; polymer blends; thermal shock; viscosity; adhesion; anhydride cured epoxy resins; anhydride sensitizing nature; crosslinking density; curing behavior; epoxy resins; epoxy/anhydride chemistry; epoxy/phenolic resin system; epoxy/phenolic resins; epoxy/phenolic system; fluxing agent; fracture toughness; no-flow underfill; no-flow underfill materials; no-flow underfills; nonanhydride curing system; nonanhydride underfill; phenolic resins; reliability; thermal shock test; thermo-mechanical properties; viscosity; Chemical technology; Chemistry; Curing; Electric shock; Epoxy resins; Materials science and technology; Materials testing; Packaging; Thermal engineering; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-64-5

Type

conf

DOI

10.1109/ISAOM.2001.916584

Filename

916584