• DocumentCode
    1745454
  • Title

    Towards a new non-destructive-evaluation of coating-substrate adhesion by laser-ultrasounds

  • Author

    Rosa, Gaëlle ; Oltra, Roland ; Nadal, Marie-Hélène

  • Author_Institution
    LRRS, Bourgogne Univ., Dijon, France
  • Volume
    1
  • fYear
    2000
  • fDate
    36800
  • Firstpage
    717
  • Abstract
    The aim of the present study is to investigate the potentiality of using laser ultrasonics for the estimation of the practical adhesion of transparent coatings (Al2O3 80 μm-340 μm), deposited onto stainless steel substrates by atmospheric plasma spraying (APS). Using an already validated model adapted to a two-layers structure suitable to calculate the in- and out-of-plane components of the mechanical displacement versus time, the interfacial stress field is computed versus the absorbed laser-energy and especially for the critical value corresponding to the interfacial fracture. A complete contactless system is used to validate the computations, using a Q-switched Nd:YAG laser coupled with a heterodyne interferometer. Therefore, the adhesion has been determined, showing that this study (i) leads to the entire stress-tensor components; (ii) gives consistent results compared to other methods; (iii) yields to a new approach of the interfacial failure mechanisms
  • Keywords
    adhesion; alumina; photoacoustic effect; plasma arc sprayed coatings; stainless steel; ultrasonic materials testing; Q-switched Nd:YAG laser; atmospheric plasma spraying; coating-substrate adhesion; contactless system; heterodyne interferometer; interfacial failure; interfacial fracture; interfacial stress; laser ultrasound; mechanical displacement; nondestructive evaluation; stainless steel substrate; stress tensor; transparent alumina coating; two-layer model; Adhesives; Atmospheric modeling; Coatings; Computer interfaces; Failure analysis; Laser modes; Optical coupling; Steel; Stress; Thermal spraying;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2000 IEEE
  • Conference_Location
    San Juan
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-6365-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2000.922647
  • Filename
    922647