DocumentCode
1745479
Title
Finite element modeling of capacitor micromachined ultrasonic transducers
Author
Roh, Yongrae ; Khuri-Yakub, Butrus T.
Author_Institution
Dept. of Mech. Eng., Kyungpook Nat. Univ., Taegu, South Korea
Volume
1
fYear
2000
fDate
36800
Firstpage
905
Abstract
A finite element model of cMUTs is constructed using the commercial code ANSYS. The complex load impedance seen by individual cells is compared with the plane wave real impedance seen by a parallel combination of the cells to make a transducer. The result shows the origin and level of crosstalk between array elements, with evidence of coupling through Stoneley and Lamb waves. For reduction of the crosstalk level, the effects of various structural variations of the wafer are investigated, which includes change of wafer thickness, etched trenches in the wafer and the walls between array elements
Keywords
crosstalk; finite element analysis; micromachining; ultrasonic transducers; Lamb waves; Stoneley waves; capacitor micromachined ultrasonic transducers; complex load impedance; crosstalk; etched trenches; finite element model; plane wave real impedance; wafer thickness; Capacitors; Crosstalk; Etching; Finite element methods; Impedance; Predictive models; Semiconductor device modeling; Silicon; Transmitters; Ultrasonic transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2000 IEEE
Conference_Location
San Juan
ISSN
1051-0117
Print_ISBN
0-7803-6365-5
Type
conf
DOI
10.1109/ULTSYM.2000.922688
Filename
922688
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