DocumentCode :
1745587
Title :
An oxygen ion dose dependence of dielectric constant and surface roughness of titanium oxide films deposited on silicon by an ion beam assisted deposition technique
Author :
Yokota, Katsuhiro ; Nakamura, Kazuhiro ; Sasagawa, Tomohiro ; Kamatani, Toshihiko ; Miyashita, Fumiyoshi
Author_Institution :
Fac. of Eng., Kansai Univ., Osaka, Japan
fYear :
2000
fDate :
2000
Firstpage :
350
Lastpage :
353
Abstract :
Titanium oxide, TiOx, films with high dielectric constants were deposited on Si surfaces by an ion beam assisted deposition technique. The dielectric constants of the TiOx films became higher with decreasing the fraction of oxygen ions during the deposition and with increasing substrate temperature, while the surface morphologies of the TiOx films became rougher. The dielectric constants and the surface roughness depended on the fraction of Ti-O bonds in the TiOx films
Keywords :
bonds (chemical); insulating thin films; ion beam assisted deposition; permittivity; rough surfaces; semiconductor-insulator boundaries; surface topography; titanium compounds; Si; Si surfaces; Ti-O bonds; TiO; TiOx; dielectric constant; ion beam assisted deposition technique; oxygen ion dose dependence; substrate temperature; surface morphologies; surface roughness; titanium oxide films; Dielectric constant; Dielectric substrates; High-K gate dielectrics; Ion beams; Rough surfaces; Semiconductor films; Surface morphology; Surface roughness; Temperature; Titanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology, 2000. Conference on
Conference_Location :
Alpbach
Print_ISBN :
0-7803-6462-7
Type :
conf
DOI :
10.1109/.2000.924160
Filename :
924160
Link To Document :
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