• DocumentCode
    1745663
  • Title

    How can experiences from reuse activities influence the development of DFE-tools

  • Author

    Hoffmann, M. ; Knoth, R. ; Kopacek, B. ; Kopacek, P.

  • Author_Institution
    Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    264
  • Lastpage
    267
  • Abstract
    Design for environment (DFE) is becoming more and more important, especially as there is a tremendous need to increase resource productivity because of the decreasing capacities of nonrenewable resources. One way to achieve this goal is to enhance a product´s lifetime. Therefore the Austrian Society for Systems Engineering and Automation started to build a demonstration plant within the Strategic CARE initiative: “Σ! 1592-Disassembly Factory”. The idea of this project is to develop a flexible semiautomatic disassembling cell for extracting valuable and reusable components from printed circuit boards (PCB). Furthermore design impacts for a concept of a “disassembly-oriented product structure” is investigated. This paper illustrates how the experience of the Disassembly Factory will influence DFE methodologies in the future
  • Keywords
    design for environment; printed circuits; recycling; Σ! 1592-Disassembly Factory; Austrian Society for Systems Engineering and Automation; PCB reusable components extraction; Strategic CARE initiative; demonstration plant; design for environment tools development; disassembly-oriented product structure; flexible semiautomatic disassembling cell; nonrenewable resources; printed circuit board reusable components; product lifetime enhancement; resource productivity; reuse activities; Design engineering; Electronic components; Electronic equipment; Flexible printed circuits; Heat transfer; Manufacturing automation; Recycling; Shape control; Systems engineering and theory; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 2001. Proceedings of the 2001 IEEE International Symposium on
  • Conference_Location
    Denver, CO
  • ISSN
    1095-2020
  • Print_ISBN
    0-7803-6655-7
  • Type

    conf

  • DOI
    10.1109/ISEE.2001.924537
  • Filename
    924537