DocumentCode :
1745665
Title :
Survey of alternatives to tin-lead solder and brominated flame retardants
Author :
Murphy, Cynthia F. ; Pitts, Gregory E.
Author_Institution :
Texas Univ., Austin, TX, USA
fYear :
2001
fDate :
2001
Firstpage :
309
Lastpage :
315
Abstract :
World-wide interest in alternatives to tin-lead (Sn-Pb) solder and to brominated flame retardants (BFRs) continues to grow, in no small part due to the WEEE (Waste Electrical and Electronic Equipment) Directive in the European Union. While regulatory and market pressures are the primary drivers in the search for alternatives, there are important efforts underway to understand the environmental impacts and performance of these new materials and systems relative to those they are slated to replace. This paper briefly summarizes these alternatives and the data collected to-date, which will lead to an improved understanding of the relative merits and drawbacks of conventional verses emerging technologies. Included are discussions of technical performance, end-of-life issues, and life-cycle analyses. A bibliography of published papers, reports, and web-sites is provided
Keywords :
environmental factors; flameproofing; soldering; Waste Electrical and Electronic Equipment Directive; brominated flame retardants; conventional technologies; emerging technologies; end-of-life issues; environmental impacts; life-cycle analyses; market pressures; regulatory pressures; technical performance; tin-lead solder alternatives; Bibliographies; Driver circuits; Electronic equipment manufacture; Electronic waste; Environmentally friendly manufacturing techniques; Flame retardants; Lead; Performance analysis; Process control; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and the Environment, 2001. Proceedings of the 2001 IEEE International Symposium on
Conference_Location :
Denver, CO
ISSN :
1095-2020
Print_ISBN :
0-7803-6655-7
Type :
conf
DOI :
10.1109/ISEE.2001.924545
Filename :
924545
Link To Document :
بازگشت