• DocumentCode
    174589
  • Title

    REEM: Failure/non-failure region estimation method for SRAM yield analysis

  • Author

    Rana, M.M. ; Canal, Ramon

  • Author_Institution
    Dept. Arquitectura de Computadors, Univ. Politec. de Catalunya, Barcelona, Spain
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    36
  • Lastpage
    41
  • Abstract
    The big challenge that we face today for designing resilient memories is the huge number of simulations needed to arrive at a good estimate of memory´s yield. A lot of work has come up recently focusing on the reduction of these simulations. The majority of these methods have focused on using different Markov Chain Monte Carlo (MCMC) methods, most notably Importance Sampling. SRAMs, though, have an interesting property of failure monotonicity which implies that given a known failure point in SRAM´s parameter space all points with larger variations will also be failure points. Our work REEM (Region Estimation by Exploiting Monotonicity), thus, focuses on exploiting the SRAM´s failure monotonicity property for faster estimation of the Failure/Non-Failure regions. The usual MCMC methods can then be used without needing actual spice simulations. Our results show that using our method we can achieve an overall 10× reduction in simulations compared to traditional Importance Sampling methods.
  • Keywords
    Markov processes; SRAM chips; failure analysis; importance sampling; integrated circuit design; integrated circuit yield; MCMC method; Markov chain Monte Carlo method; REEM; SRAM failure monotonicity property; SRAM parameter; SRAM yield analysis; failure point; failure-nonfailure region estimation method; importance sampling method; memory yield estimation; region estimation-by-exploiting monotonicity; resilient memory design; Accuracy; Computational modeling; Equations; Estimation; Mathematical model; Monte Carlo methods; Random access memory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design (ICCD), 2014 32nd IEEE International Conference on
  • Conference_Location
    Seoul
  • Type

    conf

  • DOI
    10.1109/ICCD.2014.6974659
  • Filename
    6974659