DocumentCode :
174624
Title :
Improving power delivery network design by practical methodologies
Author :
Chia-Chi Huang ; Chang-Tzu Lin ; Wei-Syun Liao ; Chieh-Jui Lee ; Hung-Ming Chen ; Chia-Hsin Lee ; Ding-Ming Kwai
Author_Institution :
Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2014
fDate :
19-22 Oct. 2014
Firstpage :
237
Lastpage :
242
Abstract :
There are many works on the power network design and prototyping for digital designs, however some usual and practical design concerns are not addressed. In this work, we present a realistic power network design methodology without IR violation certified by state-of-the-art commercial tool. Our work integrates analysis, optimization and synthesis of power network. In particular, we consider thermal effect and power pad´s positions during the prototyping of power network. A scenario in placement regarding the violation of design rules is considered and resolved by maximum flow algorithm at the same stage. After the synthesis of initial power network, we generate a sensitivity matrix which is correlated with nodal voltage and resistances of net and via in metal layers. Furthermore, a Sequential Linear Programming(SLP) will be applied to adjust the sensitivity matrix iteratively until the IR drop constraint is satisfied. Our work is experimented on a real design in TSMC 65nm LP process, and the result validates our framework that the IR-Drop can be reduced to 2% of supply voltage.
Keywords :
linear programming; transmission networks; IR drop constraint; IR violation; IR-Drop; LP process; TSMC; digital designs; maximum flow algorithm; power delivery network design; power network analysis; power network design methodology; power network optimization; power network synthesis; sensitivity matrix; sequential linear programming; size 65 nm; supply voltage; Clustering methods; Linear programming; Network topology; Optimization; Power demand; Resistance; Standards;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Design (ICCD), 2014 32nd IEEE International Conference on
Conference_Location :
Seoul
Type :
conf
DOI :
10.1109/ICCD.2014.6974687
Filename :
6974687
Link To Document :
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