Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method

Author

Vandevelde, Bart ; Beyne, Eric ; Zhang, Kouchi ; Caers, Jo

Author_Institution

IMEC, Leuven, Belgium

fYear

2001

fDate

2001

Firstpage

281

Lastpage

287

Abstract

Finite element modelling is widely used for estimating the solder joint reliability of electronic packages. However, the solder properties are strong process and geometry dependent. Even for the same type of solder, measurements conducted by different people at different locations show different results, due to differences in application conditions, benching etc. Those differences may lead to difference in constitutive equations and/or the parameter values. Therefore the effect of the solder parameter variation and parameter sensitivity should be taken into account before a reliable solder fatigue prediction can be made. In this research, simulation-based optimisation method is used to investigate the sensitivity of the chosen solder parameters for the solder fatigue prediction using inelastic strain criterion

Keywords

chip scale packaging; fatigue; finite element analysis; optimisation; reliability; soldering; CSP; constitutive equations; finite element modelling; inelastic strain criterion; life-time prediction; parameter values; simulation-based optimization method; solder fatigue prediction; solder parameter sensitivity; Chip scale packaging; Difference equations; Electronics packaging; Fatigue; Finite element methods; Geometry; Lead; Optimization methods; Predictive models; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927736

Filename

927736