Title :
Anamorphic and aspheric microlenses and microlens arrays for telecommunication applications
Author :
Raguin, D.H. ; Gretton, G. ; Mauer, D. ; Piscani, E. ; Prince, E. ; Sales, T.R.M. ; Schertler, D.
Author_Institution :
Corning Rochester Photonics, Rochester, NY, USA
Abstract :
A wafer-based fabrication process used to produce surface-relief microlenses for telecommunication applications is presented. Anamorphic and aspheric collimating lens profiles can be achieved, and samples have been measured to achieve insertion losses less than 0.2 dB/pair.
Keywords :
microlenses; optical collimators; optical communication equipment; optical fabrication; optical losses; photoresists; wafer-scale integration; anamorphic microlenses; aspheric microlenses; collimating lens profiles; insertion losses; microlens arrays; surface-relief microlenses; telecommunication applications; wafer-based fabrication process; Etching; Lenses; Microoptics; Optical coupling; Optical device fabrication; Optical refraction; Optical surface waves; Photonics; Resists; Silicon compounds;
Conference_Titel :
Optical Fiber Communication Conference and Exhibit, 2001. OFC 2001
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
1-55752-655-9
