DocumentCode
1746627
Title
High-speed electroabsorption (EA) modulator modules using the flip-chip bonding (FCB) technique
Author
Miyahara, T. ; Kaneko, S. ; Noda, M. ; Ishizaki, M. ; Kitamura, Y. ; Takagi, K. ; Tada, H. ; Hatta, T. ; Kasahara, K.
Author_Institution
Inf. Technol. R&D Center, Mitsubishi Electr. Corp., Itami, Japan
Volume
3
fYear
2001
fDate
17-22 March 2001
Abstract
We developed EA-modulator modules with over 40-GHz modulation bandwidth using the flip-chip bonding (FCB) technique. The FCB minimizes parasitic inductance and module-to-module variation in electrical characteristics, and is indispensable to high-speed EA-modulator modules for 80 Gbit/s.
Keywords
electro-optical modulation; electroabsorption; high-speed optical techniques; modules; optical fabrication; 40 GHz; 80 Gbit/s; EA-modulator modules; FCB technique; electrical characteristics; electroabsorption modulator; flip-chip bonding technique; high-speed electroabsorption modulator modules; modulation bandwidth; module-to-module variation; parasitic inductance; Bonding; Degradation; Electric variables; Frequency response; High speed optical techniques; Inductance; Optical distortion; Optical modulation; Wavelength division multiplexing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communication Conference and Exhibit, 2001. OFC 2001
Conference_Location
Anaheim, CA, USA
Print_ISBN
1-55752-655-9
Type
conf
Filename
928517
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