Title :
Measurement and evaluation of thermal transients
Author :
Székely, V. ; Török, S. ; Nikodemusz, É ; Farkas, G. ; Rencz, M.
Author_Institution :
Dept. of Electron. Devices, Budapest Univ. of Technol. & Econ., Hungary
Abstract :
Thermal transient measurement is method for the characterisation of IC packages gaining increasing importance, The measurement of these transients requires dedicated equipment. The subsequent innovative evaluation method can be applied in other fields of measurement as well. The paper discusses the innovative hardware and software solutions of the problem
Keywords :
computerised instrumentation; electronic engineering computing; integrated circuit packaging; integrated circuit testing; thermal management (packaging); thermal resistance measurement; transients; IC packages; digital compensation; hardware solutions; heating curve; pulse thermal resistance diagram; software solutions; temperature sensing; thermal echography; thermal transients measurement; Conducting materials; Heating; Integrated circuit packaging; Pulse measurements; Semiconductor device measurement; Shape measurement; Temperature; Testing; Thermal loading; Thermal resistance;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 2001. IMTC 2001. Proceedings of the 18th IEEE
Conference_Location :
Budapest
Print_ISBN :
0-7803-6646-8
DOI :
10.1109/IMTC.2001.928814
