• DocumentCode
    1746712
  • Title

    Evaluation of coaxial single range thermal voltage converters with multijunction thin-film thermoelements

  • Author

    Wunsch, Thomas F. ; Manginell, Ronald P. ; Solomon, Otis M. ; Kinard, Joseph R. ; Lipe, Thomas E. ; Jungling, Kenneth C.

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • Volume
    1
  • fYear
    2001
  • fDate
    21-23 May 2001
  • Firstpage
    449
  • Abstract
    The NIST and SNL are developing new thin-film multifunction thermal converters (MJTC) for use as standards of AC-DC difference. Elements of the fabrication process allow control of various features of the device affecting the optimal configuration (e.g. thermal time constant, heater resistance, etc...). A negative AC-DC transfer difference, caused by a capacitive coupling of AC signal to the silicon obelisk, is observed in devices with a silicon obelisk at high-frequency. A circuit model illustrates the dependence of this difference on the substrate resistivity. Devices that are assembled in a coaxially mounted single-range thermal voltage converter configuration are discussed
  • Keywords
    ceramic packaging; convertors; microassembling; seals (stoppers); thermopiles; thin film devices; transfer standards; voltage measurement; AC signal; AC-DC difference standards; Seebeck EMF; capacitive coupling; circuit model; coaxial single range thermal voltage converters; fabrication process; heater resistance; multijunction thin-film thermoelements; negative AC-DC transfer difference; optimal configuration; silicon obelisk; substrate resistivity dependence; thermal time constant; thermopile; thin-film multifunction thermal converters; vacuum packaging; Analog-digital conversion; Coaxial components; Fabrication; NIST; Optimal control; Silicon; Standards development; Thermal resistance; Transistors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference, 2001. IMTC 2001. Proceedings of the 18th IEEE
  • Conference_Location
    Budapest
  • ISSN
    1091-5281
  • Print_ISBN
    0-7803-6646-8
  • Type

    conf

  • DOI
    10.1109/IMTC.2001.928858
  • Filename
    928858